Laser Direct Writing Device "DWL 66+"
High-performance laser lithography equipment for research and development.
The "DWL 66+" is a high-resolution laser direct writing system suitable for research and development applications, small lot production, mask creation, and maskless exposure. It is equipped with the necessary functions for the fabrication and analysis of microstructures as a standard system. With high processing capability and a wide range of applications, it contributes to research and development in applications requiring microstructure fabrication, such as MEMS and micro-optics. 【Features】 ■ For maskless exposure and mask creation ■ 2.5D grayscale exposure mode (standard 128 levels, optional 255 levels or 1000 levels) ■ Versatile with rich features and expandability for multiple applications ■ Switchable up to six drawing modes (0.3um-4.0um) (pixel size) ■ High-precision alignment with backside alignment capability ■ Maximum substrate size supported is 9 inches x 9 inches ■ Compatible with various data formats *For more details, please refer to the catalog or feel free to contact us.
- Company：ハイデルベルグ・インストルメンツ
- Price：50 million yen-100 million yen
